Pwosesis koule nan tablo multikouch PCB

1 Pwosesis koule

The printed circuit board with the prepared graphics → acid degreasing → scanning water washing → secondary countercurrent water washing → micro-etching → scanning water washing → secondary countercurrent water washing → copper plating predip → copper plating → scanning water washing → tin plating predip → Tin plating → secondary countercurrent washing → lower plate

2 pwosesis detaye

2.1 Eten Plating Prepreg

2.1.1 Konpozisyon ak kondisyon fonksyònman nan fèblan-plating pre-tranpe

2.1.2 Metòd pou louvri tank prepreg fèblan 4

Premye ajoute mwatye yon silenn dlo distile, Lè sa a, tou dousman plonje epi ajoute 15L asid silfirik ak yon fraksyon mas 98 pousan, brase ak fre, ajoute 1.5L Sulfotech Pati A, brase respire, ajoute dlo distile a 300L, brase respire, epi li. se pare pou itilize.

2.1.3 Antretyen ak kontwòl fèblan-plating pre-tranpe beny

Ajoute 1L asid silfirik ak 100mL Sulfotech Pati A pou chak tablo 100m2. Ranplase beny lan chak fwa benyen an trete 1500m2 plak.

2.2 Eten plating

2.2.1 Konpozisyon ak kondisyon fonksyònman solisyon fèblan plating 5

2.2.2 Metòd pou louvri tank tinning la 2

Premye ajoute mwatye yon silenn nan dlo distile, Lè sa a, tou dousman ajoute 98L asid silfirik ak yon fraksyon mas nan 98 pousan, apre yo fin brase ak refwadisman, ajoute 40kg Eten Sèl 235 refwadi a 25 degre, ajoute 76 L Sulfotech Pati A, 15.2 L Solfotech Pati. B, 30.4 LSTHAdditive Sulfolyt, Ajoute dlo distile nan nivo likid la epi sikile (elektwolize 2AH/L nan 1.5A/dm2).

2.2.3 Antretyen ak kontwòl nan fèblan plating likid benyen

Analize fèblan ak asid silfirik anvan travay. 11L asid silfirik, 600 g Eten Sèl 235, 600 mL Sulfotech Pati A, 800 mL Sulfotech Pati B, 750 mL STH Aditif Sulfolyt ta dwe ajoute pou chak plak 100m2. Sistèm adisyon otomatik la te ajoute 56mL Sulfotech Pati A nan 200AH.

Solisyon an dwe sibi tès selil Hull la chak semèn pou obsève ak ajiste Sulfotech Pati A ak Sulfotech Pati B.

Atik Dimansyon Pi bon Valè

Sn2 plis 20-30 mL/L 24 mL/L

W(H2SO4) se 98 pousan 160-185mL/L 175mL/L

Sulfotech Pati A (Sulfotech Pati A) 30-60mL/L 40mL/L

STH (STH Aditif Sulfolyt) 30-80mL/L 40mL/L

Sulfotech Pati B 15-25mL/L 20mL/L

Tanperati opere 18-25 degre 22 degre

Katod aktyèl dansite 1.3-2.ASD 1.7ASD 2